Patents by Date

• Japanese Patent 4722486 | April 15, 2011

  4722486

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• Methods and Apparatus for Generating Strongly-Ionized Plasmas with Ionizational Instabilities | March 1, 2011

  #US07898183

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• HIGH DEPOSITION RATE SPUTTERING | October 13, 2010

  #EP01560943B1

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• High Deposition Rate Sputtering | October 12, 2010

  #US07811421

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• Methods and Apparatus for Generating Strongly-Ionized Plasmas with Ionizational Instabilities | October 5, 2010

  #US07808184

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• High Density Plasma Source | July 6, 2010

  #US07750575

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• High-power pulsed magnetically enhanced plasma processing | March 30, 2010

  EP01556882B1

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• Methods and Apparatus for Generating Strongly-Ionized Plasmas with Ionizational Instabilities | February 16, 2010

  #US07663319

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• Methods and Apparatus for Generating High-Density Plasma | October 20, 2009

  #US07604716

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• Methods and Apparatus for Generating Strongly-Ionized Plasmas with Ionizational Instabilities | March 18, 2009

  #US07345429

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• High Density Plasma Source | November 4, 2008

  #US07446479

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• High Power Pulse Magnetron Sputtering | December 12, 2006

  #US07147759

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• Methods and Apparatus for Generating Strongly Ionized Plasma with Ionizational Stabilities | August 22, 2006

  #US07095179

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• Generation of Uniformly Distributed Plasma | June 7, 2005

  #US06903511

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• High Powered Pulse Magnetically Enhanced Plasma Processing | May 24, 2005

  #US06896775

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• High Deposition Rate Sputtering | May 24, 2005

  #US06896773

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• Methods and Apparatus for Generating High-Density Plasma | February 8, 2005

  #US06853142

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• High Density Plasma Source Using Excited Atoms | October 19, 2004

  US06806652

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• Plasma Generation Using Multi-Step Ionization | October 19, 2004

  #US06805779

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• High-Density Plasma Source | October 19, 2004

  #US06806651

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